Dimensions (Syringe): 66(W) x 19 (L) x 12(H) mm
Volume/Net Weight: 1.5g
Thermal Conductivity: 8.3 W/m·K
Viscosity: 350 ~ 480 Pa.s
Operation Temperature: -40 ~ 200 ℃
Materials: Silicone Dioxide, Aluminum Oxide, Zinc Oxide
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EXCELLENT STABILITY: STC 8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity: 8.3 W/m-k.
MEASURING GRADUATION: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
OPTIMAL VISCOSITY: Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s.
EASY TO USE AND STORE: Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed
OUTSTANDING DURABILITY: Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified